HJ-6601, Chip level SIP LORA wireless module, packaged in LGA24, ultra small size (7.5 * 7.5mm), based on ASR6601. TCXO temperature compensated or passive crystal oscillator for customers to choose from. HJ-6601 is a universal LPWAN wireless communication SoC that supports LoRa communication method. Internally integrated RF transceiver, modem, and 32-bit RISC MCU.
For more detailed product information, please contact our customer service representative. Thank you very much!
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Item
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Value
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Model Number
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HJ-6601
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Type
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LORA WAN
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Country of Origin
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China
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Brand
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HJSIP
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Chipset
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ASR6601
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Application
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Wireless transmission, Internet of Things Especially suitable for fields with strict volume requirements, such as medical products, hearing aid industries, etc.
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Module Size
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7.5*7.5*1.35MM
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| Firmware |
The external interface is SPI interface |
1 Overview
HJ-6601 is a general-purpose LPWAN wireless communication SoC that supports LoRa communication. Internal integrated RF transceiver, modem and 32-bit MCU. The MCU uses the ARM STAR core, running at 48 MHz. The module include with 256KB of FLASH and 64KB of SRAM, up to 42 configurable general-purpose IO ports, with peripherals: 4*UART, 3*SPI, 3*I2C, 1*I2S, 4*ADC, 1* QSPI, 1*DAC(12-bit), 1*LPUART(Rx Only), 2*WDG, 1*SWD; and supports 4*GPtimer, 2*Basic Timer, 2*LP timer and 1*Sys Ticker, basically satisfying Development of all embedded applications. Module crystal oscillator specifications support two types: ordinary passive crystal oscillator version and TCXO temperature-compensated crystal oscillator version; RF radio frequency transceiver operating frequency supports two specifications: 410MHz - 525MHz or 800MHz - 950MHz. Ideally, the sensitivity can reach -148dBm, and the maximum transmit power is +22dBm. Users can control the internal MCU to send and receive wireless data through ARM programming and development software such as KEIL or GCC. For more details, please refer to the datasheet of ASR6601.
2 Features of the module
2.1 Features
Optional 410MHz - 525MHz or 800MHz - 950MHz free frequency band, can be used without application
Comes with 8*COM, 27*SEG LCD driver, no need for external driver chip
Hardware AES\SM2\SM3\SM4 encryption processor
Maximum transmit power +22dBm
High sensitivity (clean): -148dBm
Single power supply wide voltage power supply 1.7V-3.7V
TX peak current
RX peak current
Low power standby: 1.6uA (With RF/MCU Retention and RTC )
Ultra-low power mode
Ultra small size:7.5mm * 7.5mm * 1.3mm
Built-in 256KB FLASH and 64KB SRAM
Internal optional 32MHz passive crystal oscillator or 32MHz TCXO
2.2 Application field
Smart home wireless remote control, data transmission
Wireless POS machine
Industrial control, three-meter wireless communication
Other wireless, low-power applications
LoRaWAN, LinkWAN application
Certificate
Our products have been certified by authoritative organizations such as BQB, RoHS, SRRC, FCC, CE, IC, KC, and NCC;
Packing & Delivery
All shipments are carried with straps and vacuum packed to protect your goods
Company Profile
Tangshan Hongjia Electronic Technology Co., Ltd. was established in 2014. It is a high-tech enterprise that integrates research and development, production, and sales, with a complete industrial chain. Our main products cover BLE Bluetooth, LoRa modules, WiFi modules, 2.4G wireless modules, etc. We are an innovative technology company engaged in Bluetooth and wireless communication. Our self-developed SIP Bluetooth module, WIFI module, and LORA module using LGA packaging have an ultra small volume, which is very suitable for industries and products with strict volume requirements. The customer base covers multiple industries including healthcare, industry, electricity, smart wearables, smart homes, and more. The products have passed authoritative certifications such as ROHS, SRRC, BQB, CE, FCC, IC, Canadian IC, and are exported to various countries and regions around the world.
Our Advantages
1: In the past decade, experienced and dedicated to the research and production of Bluetooth and wireless
2: Compact in size, with a minimum size of only 4 * 4mm
3: We have multiple options for you to choose from
4: We can provide customers with various customized services
5: Stable supply to ensure customer demand
Factory
Frequently asked questions
Q1: Is this a chip? Or a module?
A1: This is a chip level SIP module, packaged in LGA and ready to use upon power on.
Q2: Are you a manufacturer or a trading company?
A2: We are manufacturers.
Q3. What is your output? Will there be out of stock?
A3. Every product is shipped in large quantities, and we will not run out of stock unless the original factory stops production.
Q4: How stable is the product?
A4: You can purchase samples for actual testing, and we will provide relevant product information.
Q5: How to purchase samples?
A5: Please contact our customer service personnel and place your order directly on made-in-china.
Q6: Can you provide ODM or OEM customized services for us?
A6: We are pleased to provide you with customized services. We have an experienced team of engineers who will provide you with complete solutions according to your requirements.
Q7: Can the product be customized with a logo?
A7: For bulk orders, we support customized logos.
Q8: What is the delivery time?
A8: Sample order, shipped within 2-5 days. Batch orders, please confirm with our customer service personnel, and we will give you a delivery date based on your quantity.
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