HJ-531IMF, a chip level SIP low-power Bluetooth module, adopts LGA25 packaging, ultra small size (5 * 4.75mm) BLE Bluetooth module, based on DA14531. Built in high-performance antenna, ultra-low power consumption, ultra-low voltage, can be powered by one AA battery. Especially suitable for fields with strict volume requirements, such as medical products, hearing aid industries, etc.
For more detailed product information, please contact our customer service representative. Thank you very much!
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Item
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Value
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Model Number
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HJ-531IMF
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Type
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BLE 5.1
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Country of Origin
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China
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Brand
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HJSIP
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Chipset
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DA14531
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Application
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Wireless transmission, Internet of Things Especially suitable for fields with strict volume requirements, such as medical products, hearing aid industries, etc.
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Module Size
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5*4.75*1.3MM
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| Firmware |
UART firmware and self-developed blank firmware |
Certificate
Our products have been certified by authoritative organizations such as BQB, RoHS, SRRC, FCC, CE, IC, KC, and NCC;
Packing & Delivery
All shipments are carried with straps and vacuum packed to protect your goods
Company Profile
Tangshan Hongjia Electronic Technology Co., Ltd. was established in 2014. It is a high-tech enterprise that integrates research and development, production, and sales, with a complete industrial chain. Our main products cover BLE Bluetooth, LoRa modules, WiFi modules, 2.4G wireless modules, etc. We are an innovative technology company engaged in Bluetooth and wireless communication. Our self-developed SIP Bluetooth module, WIFI module, and LORA module using LGA packaging have an ultra small volume, which is very suitable for industries and products with strict volume requirements. The customer base covers multiple industries including healthcare, industry, electricity, smart wearables, smart homes, and more. The products have passed authoritative certifications such as ROHS, SRRC, BQB, CE, FCC, IC, Canadian IC, and are exported to various countries and regions around the world.
Our Advantages
1: In the past decade, experienced and dedicated to the research and production of Bluetooth and wireless
2: Compact in size, with a minimum size of only 4 * 4mm
3: We have multiple options for you to choose from
4: We can provide customers with various customized services
5: Stable supply to ensure customer demand
Factory
Frequently asked questions
Q1: Is this a chip? Or a module?
A1: This is a chip level SIP module, packaged in LGA and ready to use upon power on.
Q2: Are you a manufacturer or a trading company?
A2: We are manufacturers.
Q3. What is your output? Will there be out of stock?
A3. Every product is shipped in large quantities, and we will not run out of stock unless the original factory stops production.
Q4: How stable is the product?
A4: You can purchase samples for actual testing, and we will provide relevant product information.
Q5: How to purchase samples?
A5: Please contact our customer service personnel and place your order directly on made-in-china.
Q6: Can you provide ODM or OEM customized services for us?
A6: We are pleased to provide you with customized services. We have an experienced team of engineers who will provide you with complete solutions according to your requirements.
Q7: Can the product be customized with a logo?
A7: For bulk orders, we support customized logos.
Q8: What is the delivery time?
A8: Sample order, shipped within 2-5 days. Batch orders, please confirm with our customer service personnel, and we will give you a delivery date based on your quantity.
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